Feature: Semiconductor industry shines at SEMICON West 2025
SEMICON West 2025 showcased the growth and importance of the semiconductor industry in the U.S. and beyond. Territory account managers Michael Price and Kelly Ruffenach attended and share their experience from the event in this feature.
The continued digital transformation of our world is driving remarkable growth in the semiconductor industry: PwC forecasts the global semiconductor market to top $719 billion in value at the end of 2025 and reach $1 trillion by 2030.
Meanwhile, the sting of global supply chain disruption caused by the pandemic, political strife, and other global events has prompted the U.S. to prioritize the domestication of semiconductor production. Although vastly different in approach, the Biden and Trump administrations have worked to increase semiconductor manufacturing stateside.
Exploring ways adhesives can improve semiconductor manufacturing
It’s probably no surprise, then, that attendance for the 2025 edition of SEMICON West — “the premier microelectronics exhibition in North America” — was up by 45% from 2024. The event took place from October 7-9 at the Phoenix Convention Center.
Our pressure-sensitive adhesive solutions play a key role in chemical-mechanical planarization (CMP) processes, a crucial step in the production of semiconductors. So an Avery Dennison team, including territory account managers Michael Price and Kelly Ruffenach, were part of that bustling crowd. They walked the floor, observed and spoke to exhibitors and attendees, and explored opportunities for high-performance adhesives to improve semiconductor manufacturing.
A CMP Portfolio that’s second to none — and other takeaways
Upon his return to Avery Dennison Performance Tapes headquarters in Ohio, Michael shared his top three SEMICON West takeaways.
1. An increasingly urgent need for high-quality dicing and backgrinding tapes.
As the domestic semiconductor industry expands, more manufacturers are relying on automated production processes. An easy-to-take-for-granted piece of that process is the adhesive tape used to bond abrasive pads to the planar. With automation, those adhesives must be easily removable by UV light or minimal adhesion, while still holding strong against the rigors of the CMP process.
2. A strong presence by the academic community
Michael noted a strong presence by the academic / research community. This included institutions such as the University of Arkansas, which recently opened a state-of-the-art semiconductor research and fabrication facility; and the University of Arizona, whose Center for Semiconductor Manufacturing is developing advanced semiconductor manufacturing solutions while helping train the industry’s workforce.
3. The Avery Dennison Performance Tapes CMP portfolio stands toe-to-toe with anyone in the industry
Adhesives used in CMP must provide a bond that stands up to the temperatures and forces encountered during a planarizing cycle. They need to be resistant to chemicals such as hydrogen peroxide, chelating agents, and corrosion inhibitors. And they must be removed easily and cleanly to support a fast and efficient changeover.
The Avery Dennison CMP portfolio includes pad-to-platen adhesive solutions with chemically-resistant rubber and modified-acrylic adhesives. These adhesives perform in temperatures ranging from -40°F to 350°F. They also remove cleanly from the platen. Our pad-to-pad solutions feature chemically-resistant, aggressive rubber adhesives. These offer outstanding shear strength and performance in temperatures ranging from -40°F to 225°F.
Look to Avery Dennison as a strategic manufacturing partner
“I don’t think any further proof was needed, but the attendance and energy at this year’s SEMICON West really speaks to the industry’s rapid acceleration,” says Michael. “And as manufacturers address technical challenges related to bonding for automated, high-volume production, they can look to U.S.-based Avery Dennison Performance Tapes as a strategic collaborator. We offer deep application expertise and extensive laboratory capabilities including adhesive R&D, prototyping, and customization.”
Learn more, schedule a consultation, and improve your manufacturing processes
We are growing our business in the semiconductor industry. And we welcome the opportunity to work with manufacturers to develop custom adhesive solutions for CMP.
Learn more about our pressure-sensitive adhesive technologies, CMP portfolio, and laboratory capabilities at Avery Dennison Performance Tapes. To schedule a consultation, please contact Kelly or Michael.