Chemical Mechanical Planarization (CMP) Tapes

CMP is a critical step in the production of integrated circuits, where manufacturers must smooth and planarize wafer surfaces to precise specifications. 

Consumables used in these manufacturing environments are held to extremely high standards. This includes abrasive pad constructions, in which adhesives must provide a bond that stands up to the forces encountered during a planarizing cycle. They must demonstrate resistance to the chemicals and temperatures that are common in the process. And they must allow easy and clean removal of the constructions when a cycle is completed, supporting a fast and efficient changeover.

Our solutions provide a strong initial bond, whether adhering a primary to a secondary pad, adhering a pad directly to a platen. They hold that bond through the physical, chemical, and temperature stresses of the processing cycle. They peel cleanly and easily from the platen after use.