Thermal Interface Materials (TIMs) Solutions
for EV Battery

 

Adhesive bonding solutions for heat transferring materials in EV batteries

Thermal interface materials (TIMs) facilitate the transfer of heat between components in EV Battery assemblies. 

Avery Dennison offers multiple adhesive bonding solutions for TIMs bonded to either heat sink or chiller plate materials, to assist with battery cell and battery module cooling. These include:

  • Two, high wet-out adhesives to lower thermal impedance between TIM and heat source

    • A silicone-based, pressure-sensitive adhesive offering excellent adhesion to silicone TIMs in EV batteries

    • An acrylic-based pressure-sensitive adhesive offering excellent adhesion to non-silicone based TIMs

  • Flame-retardant adhesives, tested in accordance with UL® 94 V-0, are also available

Avery Dennison EV Battery custom solutions and testing capabilities 

Avery Dennison EV Battery solutions include a wide variety of constructions, chemistries, and functional additives. Our products are backed by our superior customer service and technical support staff. You can be confident you will receive a tape that is designed and certifiable to OEM and battery manufacturer specifications. 

We also have the ability to collaborate with you on custom solutions. Avery Dennison goes beyond bonding, offering you access to testing facilities and subject matter experts that can work with your team to produce the unique product you're seeking for your EV Battery application. 

Custom Solutions

  • Global footprint

  • New product development for custom solutions for applications

  • Business development and specification support for emerging applications

  • Application engineering and technical support

Testing Capabilities

  • ISO 17025 certified laboratory

  • Traditional pressure-sensitive adhesive bulk property testing (peel, tack and shear)

  • Environmental conditioning (temperature, humidity, UV, chemical and more)

  • Flame performance and dielectric strength testing at the tape and composite level


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