Low surface energy (LSE) bonding tapes and adhesives

Avery Dennison offers a high-performance acrylic adhesive engineered for bonding with low surface energy (LSE) plastics while also offering heat resistance, holding power, and ease of converting.

LSE plastics such as polypropylene, high-density polyethylene (HDPE) and low-density polyethylene (LDPE) present a challenge to adhesive bonding. Their composition and surface inhibit the “wetting out” necessary to form a stable, lasting bond with most adhesives. Standard acrylics provide a balance of adhesion and performance properties for many applications but generally do not bond well to LSE plastics. Acrylics specially engineered for use with LSE plastics are often difficult to convert. Rubber-based adhesives may bond well with LSE plastics but have poor resistance to temperature, weather and chemicals.

Avery Dennison offers a proprietary, High Performance Acrylic (HPA™) adhesive polymer technology that addresses these issues.

Engineered for use with LSE plastics, it delivers superior initial tack and long-term adhesion and holding power, even under high temperatures and harsh environmental conditions. It also supports efficient converting, with minimal oozing, effective for producing small die-cut parts at a faster processing speed.

The bottom line is a unique combination of features: LSE performance; resistance to chemicals, weather and heat; and ease of converting.

Going beyond bonding to develop solutions that address your needs

The Avery Dennison product portfolio includes a wide variety of constructions, chemistries, and functional additives. These products are backed by our superior customer service and technical support staff. You can be confident in your Avery Dennison solution. 

We also have the ability to collaborate with you on custom solutions. Avery Dennison goes beyond bonding, offering you access to our research and development facilities and subject matter experts that can work with your team to produce the unique product you're seeking for your application.